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Trends in hybrid pixel detectors for X-ray imaging using deep submicron VLSI technology

Trends in hybrid pixel detectors for X-ray imaging using deep submicron VLSI technology
File Size:
396.27 kB
Author:
Aleksandra Drozd, Tadeusz Satława
Date:
30 April 2015
Downloads:
29 x

Abstract: The article covers the latest developments in pixel detectors used for X-ray imaging as well as the description of the practical solution – a multichannel integrated circuit dedicated to X-ray imaging. In general introduction a wide range of pixel detector applications is presented. The main part focuses on the challenges and new solutions for the field of X-ray imaging, including 3D integration, silicon-on-insulator and submicron technologies. Since minimization of a pixel size together with implementing more functionality are important issues in the detectors’ and integrated circuits’ design, the aspects of channel-to-channel uniformity and additional effects like charge sharing between pixels are taken into consideration. In the last section, the Authors present the application specific integrated circuit designed in 40 nm technology dedicated to X-ray detection and future prospects are discussed.

Keywords: X-ray imaging, hybrid pixel detectors, 3D technologies, SOI technologies

Area: Biomedical Engineering

 
 

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